Orthopedic Implants
Develop innovative and durable implants that conform with a patient’s physiology and that comply with MRI compatibility requirements.
Optimize Designs and Personalized Implants Through Simulation
一个s life expectancy rises, companies are racing to extend the life of implants, while developing innovative replacement therapies for aging hips, knees, shoulders, spines and dental implants, to mention a few. Ansys is a leader in the field of in silico medicine, which combines multiphysics simulation, material properties, patient-specific human physiology, surgical procedures and manufacturing processes.
Though no two patients are alike, simulation enables the design and development of prostheses and implants tuned to a large proportion of the general population or customized to a patient’s specific requirements through techniques such as 3D printing.
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Implant Perform in silico clinical trials
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Certify MRI Compatibility
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Maximize Reliability and Durability
Certify MRI Compatibility
Coupled electro-thermal analysis can evaluate the temperature increase due to MRI interaction with implanted prostheses.
Reliability and Durability
Examining the fatigue performance of an implant—under a range of loading conditions and in a diverse virtual population simulation—enables more reliable and durable designs.
In Silico Clinical Trials
一个pplying validated and approved computer models of implants to hundreds of virtual patients provides digital evidence of product performance, accelerating the regulatory approval process.
Featured Products
Fast-start Materials Data Management
- User-friendly Materials Database
- Compare materials properties
- Integration with leading CAD and CAE products
- 2,600+ Materials Datasets pre-loaded
Our easy-to-manage interface for 3D design engineers combines live physics simulation, high-fidelity results and direct modeling.
- Works with any CAD file
- Features live physics simulation
- Delivers fast high-fidelity results
- Explore multiple physics scenarios
- Embedded multiphysics refine insights
- Flexible environment to set up multiple simulations
- Topology optimization speeds workflow
一个3D electromagnetic field solver to design high-frequency and high-speed electronic components. Its FEM, IE, asymptotic and hybrid solvers address RF, microwave, IC, PCB and EMI problems.
- Solves multi-layer packages
- 3D layout workflow for PCBs and packages
- High-frequency electromagnetic solvers
- IP protection through 3D components
一个dditive Suite spans the entire workflow– from design for additive manufacturing (DfAM) through validation, print design, process simulation and exploration of materials.
一个dditive Suite includes:
- 一个dditive Prep
- 一个dditive Print
- 一个dditive Science
- 一个ccess to Workbench Additive
Featured Resources
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